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Our superior cooling technology to keep your temperatures low at a high framerate

 

*NEW for RX 6x50 Series* High TG Copper PCB

The GPU is mounted on to the high-density 14 layer 2oz Copper and high TG PCB to match the rapid speed, high current and increased power requirement of the GPU and memory to guarantee high stability of the PCB during operation.

 

*NEW for RX 6x50 Series* Optimized Composite Heatpipe

The composite heatpipes are fine-tuned for each individual cooling design with optimal heat flow, efficiently and evenly spreading out the heat to the entire cooling module.

 

*NEW for RX 6x50 Series* Metal Backplate with Thermal Pad

 The high quality aluminum backplate is not just for styling. It also protects the components on the backside of the PCB and helps dissipate the heat from the PCB with a high performance thermal pad in between.

 

Intelligent Fan Control

Fan speed is intelligently controlled to keep the GPU, memory, PWM IC and other components as low as possible in temperature to balance performance, and fan noise.

 

Precision Fan Control

Standard industry fans may have up to 10% difference between fan rotation cycles (RPM). The Fan IC Control on SAPPHIRE graphics cards reduce differential at approximately 3%. This up to 70% improvement on accuracy ensures that cooling and noise performance of every graphics card is up to scratch.

 

Robust VRM Cooling

The SAPPHIRE graphics cards are designed with robust VRM cooling and have a high thermal conductivity pad on the back-plate to take away the heat efficiently and effectively.

 

Robust Memory Cooling

One of the hottest parts on a next-gen graphics card is generated from memory. A robust memory cooling solution has been integrated into each SAPPHIRE graphics card to cool down memory with a specially designed independent cooling module.

 

Dual-X Cooling Technology

SAPPHIRE's acclaimed Dual-X Cooling is powered by two massive yet silent fans and state-of-the-art radiator design. The streamlined form of our 95mm blades mean greater airflow and superior heatsink coverage at lower noise compared to standard cooling designs. 

 

Tri-X Cooling Technology

SAPPHIRE’s remarkable Tri-X Cooling Solution is powered by three fans with reverse spinning direction to boost windflow beneath the fans. The tunneled fins on the fans aid in increasing the convection of airflow to ensure that Tri-X cooling is a low temperature and low noise cooling solution.

Our core parts that elevate the life of our products through quality, robustness & reliability

 

Backplate (Tough Metal Backplate)

The all-aluminum backplate provides additional rigidity that guarantees nothing bends and dust stays out. It also helps cool your card by increasing heat dissipation.

 

Two-Ball Bearing

These feature Dual Ball bearing fans, which have an approximately 85% longer lifespan than sleeve bearings in our tests. The improvements to the fan blades means the solution is up to 10% quieter than the previous generation.

 

Fan Quick Connect

If there’s a fan problem, you don’t have to return the entire card. SAPPHIRE or our channel partners will send out a replacement fan directly to you! That means they’re easy to remove, clean and replace, with just one screw holding them securely in place.

 

Fuse Protection 

In order to protect your card, the SAPPHIRE cards have fuse protection built into the circuit of the external PCI-E power connector to keep the components safe.

 

Dual BIOS

Choose between performance mode or silent mode to enhance your gaming experience.

All of the extra features that make our SAPPHIRE Boards so special and unique

 

TriXX Supported

Customize your individual style with TriXX Software and heighten your gaming experience!

 

TriXX Boost

Take gaming to the next level by adjusting your resolution options. Gain FPS by slightly decreasing resolution that is then adjusted through image sharpening for a more immersive gaming experience with much more fine-grained control over the quality vs. performance tradeoff.

 

Power Design

SAPPHIRE PULSE cards are designed with Phase Digital Power specifically for GPU and memory to aid in overclocking, balancing current distribution and averaging thermal dissipation for each power phase.

 

Free Flow

The traditional axial fan design system circulates hot air to the fan inlet resulting in higher temperature. We redesigned the airflow so that the hot air is expelled through the system fan instead, rapidly dissipating heat and includes a tunnelled fin with tiny holes which increases the convection airflow. 

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